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Introduction
Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325～#1000 and #2000～#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.
Porous microstructure
Specification
Here is a wafer fine grinding example of 8” & 12” Si wafers by #4000/#6000 wafer grinding wheels in-house and by customer. The result indicating lifetime of KINIK wafer grinding wheels with less tip wear is longer than that of competitor’s.
| Wafer | 8" Si | 12" Si | ||
|---|---|---|---|---|
| Specification | Spec | K02BIB | K02VAA | K01VAC |
| Bond | Resin | Vitrified | Vitrified | |
| Diamond# | 4000 | 6000 | 4000 | |
| Machine | DISCO_850_8"_Z2 | DISCO_850_8"_Z2 | DISCO_8560_12"_Z2 | |
| Current (A) | 9~11 | 7~9 | 5~7 | |
| Tip wear (um/s) | 0.5~0.7 | 0.8~2 | 7~12 | |
| Roughness (Ra, um) | 0.01 | 0.01 | 0.02 | |
| Exxxxx-N2 | KINIK | Competitor |
|---|---|---|
| Machine | DISCO_840_8"_Z2 | |
| Current (A) | 5~6 | 5~6 |
| Tip wear (um /s) | 0.3 | 0.9 |
| Roughness (Ra, um) | 0.01 | 0.01 |
