KINIK COMPANY
886-2-26791931
886-2-26786191
No. 64, Zhongshan Rd.,Yingge Dist., New Taipei City 23942, Taiwan
www.kinik.com.twProducts
Specification
Application
Wafer chuck for semiconductor dicing,grinding,washing…etc.
Features
-
Reusable
Reusable after rework. -
wear resistance
With the feature of extreme hardness of ceramics. -
No dust
Completely sintered, without dust. -
Light weight
With uniform pores, and light weight.
Brief introduction
Work Pieces can be adhesively fixed by aligning the porous to the body of the metal (or ceramic), and applying negative pressure from the back and sides of the body.
Due to the pores that are very tiny and averagely spread, vacuum chuck would not cause harms and scratch on your work pieces, improving the yield rate, making the best partner of manufacture.
Basic porous structure
Cross-section of aluminum chuck table
With larger and limited pores, distortion of workpiece might occur.
Specifications
| Commonly used specification | |
|---|---|
| Pore diameter (μm) | 2~100 μm |
| Flatnes | 0.002 mm minimum (Customized) |
| Porosity (%) | 35~50 % |
| Surface Color | Black / White / Tawny |
| Shape | Round, Square, Cylindrical, Customized |
| Body materials | Stainless steel Aluminum Titanium alloy Ceramics |
| Size | Round (Φ5mm to Φ600mm, 6"~12") Square (50mm x 50mm ~ 1,000mm x 1,000mm) |
| Body surface processing | Fluorine resin processing Alumite processing Electroless nickel plating |
