This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.




PRINCIPLES OF EQUIPMENT:

The upper and lower grinding discs rotate in opposite directions.The movement of the workpiece is both revolutionary and self-rotating.Both sides are evenly grounded,the grinding resistance is small and does not damage the workpiece.



MAIN FEATURES:

·The main structure of the machine adopts a one-time forming process, and the reasonable structure greatly improves the rigidity of the machine.

·Set each relevant parameter directly through the touch screen.The LCD touch screen displays the current working state and related setting parameters in real time.The system provides 500 data storage.Menu-style operation is convenient and quick.

·Stepless variable frequency for speed-regulating, stable start&stop without impact. The upper and lower grinding discs are equipped with a fast rise and fall, a slow rise and a slow down function.Effectively reduce product scrap rate.

·Efficient and stable transmission system which with helical gear has low noise.

·Upper grinding disc automatically leveling,Effectively solve the wrong disk problem.The upper grinding disc has self-locking function,further improvement in safety performance.

·Reduce center gear diameter and increase processing area, Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.Save energy while improving production efficiency.

·The sun gear and the inner ring gear move synchronously,meeting the requirements of picking and placing workpieces and adjusting the meshing position of the carrier.

·Fully lubricated the opposite moving surfaces with a centralized lubrication system.

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