The TM3B thermophysical microscope is mainly used for the thermal permeability test of thin film materials such as semiconductors. It uses a point laser to periodically heat the sample. It is a non-contact method to test the thermal diffusivity of the material. The film thickness can also be tested at hundreds of nanometers. The point laser method can accurately grasp the Z-axis heat conduction state of the material, with the XY electronic control platform to record the thermal conductivity of each coordinate point, and the special analysis software 3D visually analyzes the material thermal conductivity area distribution map, which is helpful to determine the thermal conductivity defects
TM3B series thermal diffusivity test instrument can test a wide range of materials of solid samples, such as aluminum oxide (Al2O3), silicon carbide (SiC), aluminum nitride (AlN), or gallium arsenide (GaAs) electrode plating gold (Au) surface convex Block ... etc.
In addition to the excellent performance of the thermal diffusivity in the same direction, the instrument can also measure and evaluate the thermal diffusivity in different directions.

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【 feature of product 】

* Thin film thermal diffusivity test above Sub micron
* Non-contact samples with laser heating
* The sample size does not need to be standardized, 30x30x3mm or less
* With XYZ stage, it can be continuously tested and imaged
* PI, SiC, AlN, Al2O3, Au, ... and other thin film materials testing
* Additional functions: thermal penetration rate (b), volumetric heat capacity (C), thermal conductivity (λ)

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